3D packaging, where integrated circuits (ICs) are combined, stacked and interconnected, combines CPUs, memory, logic, sensors and optoelectronics into a much smaller, thinner and more powerful form factor than traditional horizontal 2D packaging. The industry megatrend is moving from current 2D packaging to 3D stacking, with wires or surface bump bonding with vias for connections. More advanced 3D integrated circuits may utilize Through-Silicon Via (TSV) interconnects to reduce footprint, increase silicon efficiency and create shorter communication interconnects.

3C for 3D Solution

Waytronx Technology is designed to address system limitations in three focused areas: Cooling, Communications and Current.

For Cooling, Waytronx WayCool Technology addresses the advanced thermal management that is necessary to meet the demanding performance requirements of modern processors. Learn more about WayCool Solutions. 

For Communications and Current, Waytronx WayFast Technology focuses on high speed data communications and power management at highly increased rates. Learn more about WayFast Solutions.

 

To learn more about the Waytronx 3C for 3D roadmap, contact our development team at (866) WAYTRNX or send an email at engineering@waytronx.com.