Waytronx Stacks Up

In memory stacks, 3D packaging integration can provide a 1000x increase in speed and a 100x decrease in power consumption. The transfer rate between chips is in the terabyte/second range, and there is the potential for a massively parallel i/o architecture.  

WayCool architecture and WayFast i/o technology can be applied in various combinations of semiconductor memory packaging including system-in-package solutions, supporting the rapid industry demand for high density, high-performance semiconductor solutions for next-generation computing.

If you're a system designer focused on memory solutions, call our development team to learn more about we can help you succeed at (866) WAYTRNX or write to us at engineering@waytronx.com.