Thanks to our unique, openly-licensable business model, Waytronx™ WayCool™ patent coverage is available to our customers. 

Patented and patent-pending embodiments include: 

• Fluid-immersed cooling of electronic components
• Spill-proof seals for mounting the device on ICs
• Hermetically sealed coolers
• Embedded coolers within the circuit board
• Hierarchical channel system for spatial and thermal separation of intake and outflow
• Combination of carbon-based heat conductors with micro
  mesh heat exchangers

To find out more about how the Waytronx patent portfolio can help your business succeed, please call us at (866) WAYTRNX or drop us an email at engineering@waytronx.com.